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Parasitic effects of air-gap through-silicon vias in high-speed three-dimensional integrated circuits
Analog-Digital Co-existence in 3D-IC Gilad Yahalom
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RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking - ScienceDirect
Compact Modeling and Analysis of Through-Si-Via-Induced Electrical Noise Coupling in Three-Dimensional ICs
Analytical and Numerical Model Confrontation for Transfer Impedance Extraction in Three-Dimensional Radio Frequency Circuits
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The reduction of keep-out zone (∼10×) by the optimized novel trench structures near the through silicon vias for the applicat
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Passive Equalizer Design for Through Silicon Vias with Perfect Compensation
